光刻機(jī)- Ultratech
Wafer Size: 3", 4", 5", 6", or 8"
Loader type: Automation/Manual
Computer: HP 362
Depth of Focus: 3.0 ums @1.0um lines
Depth of Focus: 7.0 ums @1.4um lines
Uniformity: 3%
Reticle Size 3" x 5" x 0.090"
Maximum Area 34.2 x 13.6 mm
Maximum Aspect: 39 x 11.4 mm
High wafer plane irradiance
Maximum Square 18 x 18 mm
